Die Attach Process Tool Development for Voids Calculation

Abstract

Voids detection is one of the challenges during the application of non-conductive adhesives particularly die attach film (DAF) for semiconductor integrated circuits (IC) products, concerning production control robustness and detection. In this paper, a specialized tool capable to distinguish and quantify the amount of DAF voids is presented wherein the implementation of semi-auto grid lines generates more accurate measurement and correct defect call-out. The in-house software tool is an alternative cost-effective option for X-ray inspection that is found to be incapable of proper detection and accurate calculation of gaps and un-occupied area within the adhesive thickness that produces over estimation of production rejects. Ultimately with the use of the new tool, better accuracy and credibility of voids measurement was realized.