Evaluation of Adhesively-bonded Stiffeners by Numerical Modelling

Authors

  • J. A. M. Ferreira Departamento de Engenharia Mecânica, Instituto Superior de Engenharia do Porto, Instituto Politécnico do Porto, Rua Dr. António Bernardino de Almeida, 431, 4200-072 Porto, Portugal.
  • R. D. S. G. Campilho Departamento de Engenharia Mecânica, Instituto Superior de Engenharia do Porto, Instituto Politécnico do Porto, Rua Dr. António Bernardino de Almeida, 431, 4200-072 Porto, Portugal and  INEGI – Pólo FEUP, Rua Dr. Roberto Frias, s/n, 4200-465 Porto, Portugal.

DOI:

https://doi.org/10.9734/bpi/tier/v3/16156D

Keywords:

Structural adhesive, adhesive joint, T-stiffener, numerical modelling, finite element method, cohesive zone model

Abstract

Large-scale implementation of a particular bonding process in any industry needs accurate tools for failure design and prediction. The performance of a structural adhesive (Araldite® 2015) on a T-stiffener with composite adherends made of an epoxy matrix reinforced with carbon fibres is investigated in this study. The aim of the work is to numerically study, by the Finite Element Method (FEM) and Cohesive Zone Models (CZM), the behaviour of different T-stiffener bonded with a structural epoxy adhesive when subjected to peel loads and different geometries. A parametric study was carried out, considering an elastic stress analysis and maximum load (Pm) prediction based on CZM modelling, considering the variation of four geometrical parameters: flat adherend thickness (tP), stiffener thickness (t0), overlap length (LO) and curved deltoid radius (R), to achieve the optimal configuration. All tested parameters had a substantial effect on both stress distributions and Pm, allowing the optimal joint parameters for T-stiffeners to be determined.

Published

2022-06-01

How to Cite

J. A. M. Ferreira, & R. D. S. G. Campilho. (2022). Evaluation of Adhesively-bonded Stiffeners by Numerical Modelling. Technological Innovation in Engineering Research Vol. 3, 102–110. https://doi.org/10.9734/bpi/tier/v3/16156D