1.
Konstantin O. Petrosyants and Nikita I. Ryabov. Quasi-3D Thermal Modelling of Advanced Electronic Systems in Package. TAER-V3 [Internet]. 2024 Jan. 12 [cited 2026 Aug. 18];:120-56. Available from: https://stm.bookpi.org/TAER-V3/article/view/13058