Konstantin O. PETROSYANTS; Nikita I. RYABOV. Quasi-3D Thermal Modelling of Advanced Electronic Systems in Package. Theory and Applications of Engineering Research Vol. 3, [S. l.], p. 120–156, 2024. DOI: 10.9734/bpi/taer/v3/2609G. Disponível em: https://stm.bookpi.org/TAER-V3/article/view/13058. Acesso em: 19 jun. 2026.