Gaudentiu VARZARU; Mihai SAVU; Bogdan MIHAILESCU; Ciprian IONESCU; Mihai BRANZEI. Investigating the Use for Solderless Assembly for Electronics of Some Electrically Conductive Composite Materials. Recent Progress in Science and Technology Vol. 8, [S. l.], p. 153–175, 2023. DOI: 10.9734/bpi/rpst/v8/18843D. Disponível em: https://stm.bookpi.org/RPST-V8/article/view/10106. Acesso em: 3 jun. 2026.