Engineering Education: A Digital Gateway to Global Opportunities

Authors

  • Nandini Duggi ECE, VNR VJIET, Hyderabad, Telangana, India.
  • Pallavi Sharma ECE, VNR VJIET, Hyderabad, Telangana, India.
  • Neeharika Gopina ECE, VNR VJIET, Hyderabad, Telangana, India.
  • Manunuru Naga Sree Lekha ECE, VNR VJIET, Hyderabad, Telangana, India.

DOI:

https://doi.org/10.9734/bpi/mono/978-93-48859-10-5/CH7

Keywords:

Global internships, international collaboration, engineering education, digital global collaborations

Abstract

In today’s world, engineering education transcends national borders through global internships, joint research projects and exchange programs. This study examines student preferences, motives, and challenges in participating in these opportunities, and it is backed by a survey of 24 engineering students. The findings show a strong interest in overseas internships and research projects, with the main motivators being skill development, global exposure, and professional growth. However, limitations such as a lack of understanding, restricted access to technology, and time zone differences impede participation. Emerging technologies such as Generative AI, augmented and virtual reality (AR/VR), and blockchain are highlighted as revolutionary solutions for overcoming these hurdles by enhancing accessibility and fostering cooperation. The paper addresses the drawbacks of digital global collaborations, offering strategies and methods to improve their quality and extend these opportunities to a broader range of aspiring engineers. This paper promotes engineering education and workforce quality through advanced digital technologies, emphasizing the need for reimagined curricula and institutional strategies that integrate global trends and foster inclusive and interconnected educational environments.

Published

2025-01-11

How to Cite

Nandini Duggi, Pallavi Sharma, Neeharika Gopina, & Manunuru Naga Sree Lekha. (2025). Engineering Education: A Digital Gateway to Global Opportunities. Digital Crossroads: Integrating Humanities, Science and Technology Edition 1, 72–83. https://doi.org/10.9734/bpi/mono/978-93-48859-10-5/CH7