I. RASIDI I.; N. H. RAFAI; E. A. RAHIM; S. A. KAMARUDDIN; H. DING; K. CHENG. Investigating the Cutting Mechanics in 2 Dimensional Ultrasonic Vibration Assisted Milling towards Chip Thickness and Chip Formation. Advanced Aspects of Engineering Research Vol. 15, [S. l.], p. 1–7, 2021. DOI: 10.9734/bpi/aaer/v15/6737D. Disponível em: https://stm.bookpi.org/AAER-V15/article/view/1737. Acesso em: 13 jun. 2026.